Interconnecting WLP, MEMS & 3D Integration
October 13 - 15, 2015
DoubleTree San Jose Airport Hotel
San Jose, CA

IWLPC - Interconnecting WLP, MEMS & 3D Integration

SMTA and Chip Scale Review are pleased to announce the 12th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.

Registration Now Open!

View the full conference program

GLOBALFOUNDRIES, Director, Package Architecture & Customer Technology (PACT) Rama Alapati to Keynote IWLPC 2015

IWLPC Keynote Rama Alapati

High Density Fan-Out: Evolution or Revolution

Tuesday, October 13, 2015

Continued form factor and IO density scaling pressures have necessitated innovation in wafer level packaging technologies including High Density Fan-Out at leading edge Si nodes. A thorough analysis of the end applications reveal clear IO density envelopes for multi-die Fan-Out packages. Industry solutions of today are very fragmented, enabling disruption in the application space. Silicon Foundries entry in to the Fan-Out space also clearly highlights opportunities for value capture in this expanding package format. For traditional players in this field "collaborative competition" enables a new way of competing with the foundries and business models that enables this new paradigm are possible and viable.

Rama Alapati is leading the Packaging Product Management group with focus on delivering package differentiated solutions. Rama led the 3D TSV technology start-up in GLOBALFOUNDRIES Fab 8 for sub-20nm nodes. He was also responsible for sub-20nm CPI qualification until recently. Rama represents GLOBALFOUNDRIES in consortia like imec, SRC and SEMATECH to drive packaging focused research programs. Prior to joining GLOBALFOUNDRIES, Rama was with Micron Technology for 8 years first as an etch engineer focused on pitch doubling technology for sub-50nm NAND and later on as a assignee at imec focusing on 3D-IC and BEoL integration. Rama graduated with Master of Science (Honors) in chemical engineering from the University of Kansas, Lawrence and prior to that received his Bachelor of Technology degree with distinction from Osmania University in Hyderabad, India. Rama has 25 granted patents, more than 10 publications and more than 25 invention disclosures pending adjudication at the USPTO. Rama was awarded the 2014 SRC "Mahboob Khan" award for mentorship of graduate students

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