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2012 Sponsors:

Platinum Sponsors:
Amkor Technology

Invensas

STATSChipPac

Gold Sponsors:
Deca Technologies

Nanium

Pac Tech USA

SUSS MicroTec



Supported by:




International Wafer-Level Packaging Conference


SMTA and Chip Scale Review are pleased to announce the 9th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition was a huge success. IWLPC brought together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging. Registered attendance was up 30% from last year and 45 exhibitors joined the event to showcase their technology.

Keynote Speaker Announced

IWLPC Keynote John Ellis John Ellis, Author and CEO at Neodigm Press, CTO at Blue Mustang, will detail the very possible threat of Cyber-Physical Terrorism in his presentation, "A Trojan Chip in Your Smartphone? It's Coming..." For years there have been concerns about malicious circuits being used to disrupt our critical infrastructures. However, there was little chance that rogue chips could receive commands in the coordinated fashion required to cause serious damage. Social networks have changed all of that. Hacking a few, highly-followed, celebrity accounts would provide a perfect avenue for distributing 'self-destruct' codes to millions of Trojan chips. A widespread, cyber-physical attack, which would have been almost impossible to pull off just a few years ago, could soon become reality.

Submit an abstract for 2012!

The IWLPC Technical Committee would like to invite you to submit an abstract for this program. Deadline for submittal is April 27, 2012. Abstracts can be submitted quickly and easily from the Call for Papers page.

Order the 2011 Proceedings from the SMTA BookStore.
IWLPC 2011 Proceedings on USB Flash Drive
Non-Member Price: $160.00
Member Price: $150.00

The 8th annual IWLPC addressed cutting edge topics in 3 key technology tracks: Wafer-Level, 3D, and MEMS packaging. The proceedings contain over 30 technical papers from leading experts in the advanced packaging industry. The conference took place October 3-6, 2011 at the Marriott Hotel in Santa Clara, CA.



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