Save the Date for IWLPC 2016!
October 18 - 20, 2016
San Jose, California, USA

SMTA and Chip Scale Review are pleased to announce the 13th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.

Submit an abstract for IWLPC 2016!

Deadline for submission of abstracts for the 2016 program is April 15, 2016.
Click here to submit an abstract!

IWLPC General Chair Announced

Curtis Zwenger SMTA and Chip Scale Review magazine are pleased to announce Curtis Zwenger, Amkor Technology’s Senior Director, Advanced Package Technology and Integration, as the new General Chair for the 13th Annual International Wafer-Level Packaging Conference held October 18-20, 2016 in San Jose, CA.

Curtis was selected by SMTA/Chip Scale Review Magazine to serve as General Chair. As general chair, he will work closely with the Technical Chair, Advisory Committee, SMTA Education Manager and Chip Scale Review to manage and direct the activities of the entire committee and ensure critical tasks remain on schedule. Under his leadership, they will build a strong technical conference that includes two days of three tracks with technical paper presentations covering Wafer Level Packaging, 3-D (Stacked) Packaging, and MEMS Packaging. He previously served as the WLP Track Chair where he helped identify and build high quality speakers and topics in the WLP track.

Curtis holds a degree in mechanical engineering from Colorado State University and an MBA from the University of Phoenix. He has over 20 years of experience in the semiconductor industry and is currently responsible for the development and commercialization of Amkor’s Advanced Wafer-Level Fan-Out and Glass Substrate product lines. He joined Amkor Technology in 1999 and has held leadership roles in developing Amkor’s Fine Pitch Copper Pillar, Through Mold Via, and MEMS packaging technologies. Prior to joining Amkor, he worked for Motorola. He has published several papers and holds 12 patents related to semiconductor package engineering.

Interconnecting Wafer-Level packaging, 3D, and MEMS, the International Wafer-Level Packaging Conference (IWLPC) has been at the forefront of packaging technology evolution; it is one of the premier packaging conferences. Attendees from over 16 countries gather in the heart of Silicon Valley to attend IWLPC to enrich themselves on the latest technology and business trends. Going into its 13th year the IWLPC is co-produced by Chip Scale Review, the leading international magazine addressing the semiconductor packaging industry and SMTA, the distinguished global association in electronic assembly and manufacturing.

If you would like to present at this conference, please submit a 200-300 word abstract by April 15, 2016. Please include a title, author name, and contact information with your abstract. Technical papers and presentations are required and will be due September 4, 2016.

For more information, please contact Jenny Ng at 952-920-7682 or

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Organized by SMTA and ChipScale Review