IWLPC Celebrates a Successful 10 Years!
Similar to wafer-level packaging technology itself, the 2013 International Wafer-Level Packaging Conference (IWLPC) technical presentations covered a large range of applications, challenges, and solutions. This 10th anniversary event with over six hundred total participants had thirty-nine presentations in three parallel tracks over the two days. In addition to "traditional" applications of WLP for integrated circuits (IC) covered in the "WLP" and "3D" presentation tracks, microelectromechanical systems (MEMS) WLP applications were highlighted in the "MEMS" track and general sessions this year.
The conference opened with a fascinating history lesson on the origins of Silicon Valley by Paul Wesling (IEEE Components, Packaging, and Manufacturing Technology Society CPMT Distinguished Lecturer). Mr. Wesling’s keynote described how the ecosystem of companies of the vacuum tube era collaborated and prospered. This lead to the rise of Silicon Valley from these garages and sheds to that of the familiar Hewlett-Packard and Apple garages and well beyond. It is clear that the WLP ecosystem benefits from similar collaborations that are enabled by the IWLPC.
Marco Aimi (General Electric Global Research Center - GE GRC) provided a high energy plenary on the industrial applications of MEMS. Rozalia Beica (Yole Développement) kicked off the MEMS presentation track with a market overview of MEMS packaging along with what makes it special, i.e., higher cost than IC packaging. In "30 Years of Microsystem Packaging: From Automotive to Mobile Electronics and Beyond," Leland "Chip" Spangler (Aspen Microsystems) traced the development of the MEMS industry from the pressure sensors developed in response to the United States Clean Air Act of 1970 to the present. Other speakers in the MEMS track also highlighted their application-specific WLP packaging challenges.
Interest in 3D IC packaging has increased significantly from last year with a total of nineteen papers, resulting in two parallel tracks of 3D papers on day two of the conference, in addition to a single track on day one. In the 3D plenary, "A Consumer Driven Market – This Changes Everything," Simon McElrea (Invensas Corporation) highlighted how technology – electronics and computing in particular – have significantly changed from being government and industry driven, to being consumer driven. Once a market changes to being consumer driven, the volumes skyrocket, while the price per unit plummets. Several of the 3D Track presentations covered interposer technologies from silicon to alternative materials including through-glass vias (TGV) by Sergio Cadona (nMode) and phase change alloys (PCA) by Semyon Savransky (The TRIZ Experts). These topics were also covered by Professor Rao Tummala (Georgia Institute of Technology) in his well-attended tutorial. Test and metrology for 3D were covered including presentations by James Quinn (Multitest) and Rajiv Roy (Rudolph Technologies). The 3D Panel of Laura Rothman Mauer (Solid State Equipment), Suresh Ramalingam (Xilinx), Jim Walker (Gartner Technology), and Abe Yee (NVIDIA Corporation) explored how close 3D packaging is to mainstream applications.
Presentations on automation, test, materials, processes, and new technology comprised the WLP Track. Many of the presentations had new solutions or twists on existing technology. For example, William Rogers (DECA Technologies) discussed how DECA was fabricating WLP using continuous flow equipment on larger panels based upon processes and equipment developed for solar panels. The continuous flow and larger panel sizes allow them to significantly reduce their costs and to improve the processing with innovations such as adaptive patterning.
In the exhibit hall, the fifty-five exhibitors demonstrated a large variety of equipment, software, and services related to WLP. Everything from enabling technology, to process inspection, to test equipment, to consumables, to turnkey services for WLP was represented. The show floor was busy throughout the conference and a number of exhibitors commented on the increased level of interest.
Save the Date! IWLPC will return to the DoubleTree Hotel in San Jose, California next fall, November 11-13, 2014.
Submit an abstract for 2014!
The IWLPC Technical Committee would like to invite you to submit an abstract for this program. Deadline for submitting an abstract has been extended to April 18, 2014. Abstracts can be submitted quickly and easily from the Call for Papers page.
What You Are Saying About IWLPC
We have participated in the IWLPC for the last two years and have found that the technical presentations have been very enlightening. IMT being a MEMS foundry utilizes wafer level packaging in over 70% of the products that we produce and would not miss this important conference. We also found the exhibit hall experience very valuable.
-Michael Shillinger, Founder, Innovative Micro Technology (IMT)
The International Wafer Level Packaging Conference has consistently been an excellent venue for both its technical presentations and vendor exhibits. We have been attending the IWLPC for the last seven years and found it to be very valuable for both our people and company.
-Robert Marshall, RMM
IWLPC is the premier conference for emerging packaging technologies from the chip scale to the wafer scale. The conference brings together vendors, users and decision makers and is extremely valuable to EV Group.
-Garrett Oakes, Technology Director, EV Group
IWLPC brings visitors from around the world to a focused event that allows exchange of new developments and ideas.
-E. Jan Vardaman, President, TechSearch International, Inc.